Adhesive Single-Lap Joint Evaluation Using Ultrasound Guided Waves

Abstract

This work deals with the evaluation of adhesive single-lap joints using ultrasound guided waves; in particular, it is intended to characterize the signal propagation when defects are present in the adhesive joint by simulation and experimental approaches. The propagation of guided waves in the joint is developed from matrix formulations. The behavior of the guided wave modes that exist in the bonded region is characterized. It is found that its amplitudes can be estimated from the properties of the incoming wave that propagates in the non-bonded region. It is verified that the excitation of these modes is related to the degree to which the shapes of both modes match each other. A 3D simulation of two aluminum-bonded plates using 500 kHz ultrasonic transducers in a pitch-and-catch configuration was implemented using the Matlab k-Wave toolbox. Scattering effects, due to some defects located in the bond line of the joints, were simulated. The experimental setup with some artificial defects produced in the aluminum joints was used in order to compare it with the simulation. Qualitative agreement was observed between the two approaches. The observed deviation can be due to the different characteristics of the experimental and simulated defects.